成分资料
|
ALLOY/ALLAGE |
Ag |
Al |
As |
Au |
Bi |
Cd |
Cu |
Fe |
In |
Ni |
Pb |
Sb |
Sn |
Zn |
|
Sn100C(Ge-0.005-0.007) |
0.05 |
0.002 |
0.03 |
0.05 |
0.03 |
0.002 |
0.5-0.7 |
0.02 |
0.1 |
0.04-0.07 |
0.05 |
0.05 |
Balance |
0.002 |
|
Sn100Ce(Ge-0.005-0.007) |
0.05 |
0.002 |
0.03 |
0.05 |
0.03 |
0.002 |
0.1 |
0.02 |
0.1 |
0.04-0.07 |
0.05 |
0.05 |
Balance |
0.002 |
SN100C一览
* 不含银或铋。
* 共晶合金。
* 焊接无桥连，无锡尖 。
* 无论何种冷却速率下，焊点光滑、亮泽、规整，无微裂纹。
* 通孔焊透性良好。
* 在通孔焊接中可形成良好的正面焊点。
* 浮渣率等于或低于锡-铅焊料。
* 无需氮气。
* 不会腐蚀各种焊孔、焊盘和焊接线路上的铜。
* 铜浸出速率低，因而容易控制锡槽中的铜含量。
* 对不锈钢和其他锡炉材料的侵蚀性比锡-银-铜合金低。
* 抗热疲劳性能和蠕变强度优于锡-铅。
* 焊料/基材界面上金属间层的生长缓慢、均匀。
* 在选择性焊接和浸焊中亦有良好表现。
成本底线
客户多年的经验表明，若综合考虑所有因素，在标准波峰焊接机上使用SN100C的总成本仅相当于在同一焊接机上使用锡-银-铜合金成本的1/3。不同情况下实际节支取决于所涉因素的多少，但使用了SN100C的生产线的成本始终低于在同一工作线中使用锡-银-铜合金的成本。
SN100C焊料表面比较
Sn63/Pb37 SN100C Sn99.3/Cu0.7 Sn/Ag3.8/Cu0.1 Sn/Ag3/Cu0.5 (SAC305）
振动测试
用JCAA/JG-PP进行的测试证明，当与NiPbAu或纯锡的元器件表面结合进行振动测试时，SN100C优于SAC合金和锡铅。
合金相容性
测试表明，将SN100C与锡-银-铜或其他无铅合金混合时，未发生退化现象。因此，用SN100C进行波峰焊和用SAC305进行SMT是可接受的，不会影响其可靠性。此外，用SN100C锡丝搭上SAC305焊点时，未发现可靠性下降，反之亦然。
SN100C规格
|
材料性质 |
SN100C |
测试方法 |
|
熔点（℃） |
固相线227 |
不同热分析所用升温速率20°/分钟 |
|
液相线227 |
|
S．G． |
7.4 |
S．G．测定仪器25° |
|
比热[J/Kg.K] |
220 |
估计值 |
|
热导率[J/m.s.K] |
64 |
估计值 |
|
维氏硬度 |
缓慢冷却 |
16.1 |
浇铸到铝板上 |
|
快速冷却 |
12.9 |
浇铸到绝热砖上 |
|
抗张强度[M.Pa] |
32 |
10毫米/分钟(25℃) |
|
延展率[%] |
48 |
10毫米/分钟(25℃) |
|
电阻[ υΩm] |
0.13 |
用于终端法（25℃) |
|
热膨胀系数 |
30-80° |
0.00133 |
条件：负荷：10.0克, 样品：氧化铝（20毫米）， 程序升温：10°/分钟 |
|
80-130° |
0.00138 |
|
130-180° |
0.00146 |
|
扩展率﹪ |
240° |
77 |
JIS Z 3197 |
|
250° |
77 |
|
260° |
78 |
|
280° |
78 |
|
蠕变强度（至重物下落时的时间） |
145° |
>300小时 |
145° 负荷1千克 |
|
150° |
>300小时 |
150° 负荷1千克 |
|
180° |
>300小时 |
180° 负荷1千克 |
|
沾锡时间（秒） |
|
Ta |
Tb |
F最大 |
沾锡平衡
0.3×3.5×25毫米
Ta=零交叉时间
Tb=沾锡时间
F最大=最大沾锡力 |
|
240° |
1.0 |
4.53 |
0.159 |
|
250° |
0.86 |
2.79 |
0.181 |
|
260° |
0.47 |
1.46 |
0.186 |
|
270° |
0.31 |
0.8 |
0.192 |
|
260℃下的铜腐蚀速率 |
~2分钟 |
完全腐蚀∮0.18毫米铜线所用时间 |
|
热冲击 |
>1000次循环 |
每小时-40/+80° |
|
电迁移时间 |
>1000小时 |
40°95%相对湿度&85°85%相对湿度 |
|
锡须发生时间 |
>1000小时 |
50° |
热循环之前和之后的合金适应性测试数据
|
合金 |
0次循环 |
1000次循环 |
|
SAC305 |
15.3磅 |
15磅 |
|
SN100C+SAC混合焊料 |
14.1磅 |
14.3磅 |
|
SN100C |
14.2磅 |
14.0磅 |
|
Sn/Pb |
14.8磅 |
14.5磅 |
结果显示，用SAC、SN100C和SN100C+SAC混合焊料得到的焊点均与在同一块板上得到的锡-铅焊点相当。此外，据测定热循环应不会令这些焊点产生退化。
用SN100C进行波峰焊的推荐参数
|
预热 |
焊料波 |
停留时间 |
|
100-115℃ |
260-270℃ |
最少5秒 |
成功通过尝试与测试
1999年以来，全球主要电子制造商都通过SN100C获得了出色的结果。迄今为止，各类产品中，已有数百万电路板使用SN100C列焊料组装而成。众多使用SN100C焊接的器件已经应用多年。
SN100C is a lead-free solder alloy developed by Nihon Superior in Japan comprised of tin, copper,and a small amount of nickel + germanium. SN100C offers user friendly properties and has Sn-37Pb been proven in commercial production for over six years.
The result of these advantages is that SN100C offers high-throughput and the lowest cost of ownership as compared to any other lead-free solder alloy.
SN100C At A Glance
* Does not contain silver or bismuth.
* Eutectic alloy.
* Bridge-free and icicle-free soldering.
* Smooth, bright, well-formed fillets, free of gross micro-cracks, irrespective of the cooling rate.
* Good through-hole penetration.
* Good topside fillet formation.
* Dross rate equal or lower than tin-lead solder.
* Does not require a nitrogen atmosphere.
* Does not erode copper from holes, pads and tracks.
* Low rate of copper leaching makes it easy to control the copper content of the solder bath.
* Lower aggressiveness to stainless steel and other solder pot materials as compared to tin-silver-copper alloys.
* Thermal fatigue resistance and creep strength better than tin-lead.
* Slow, even growth of the intermetallic layer at the solder/substrate interface.
* Also performs well in selective and dip soldering.
The Bottom Line
Customer experience over several years is that the TOTAL cost of running a standard wave soldering machine with
SN100C when all factors are taken into account can be up to one third the cost of running the same machine with
tin-silver-copper alloys. The actual savings in each case will depend on the number of factors that apply, but the cost of
running a line with SN100C is always lower than the cost of running the same line with tin-silver-copper.
Please contact AIM for additional information.
SN100C Solder Surface Comparison
Rapid Cooling
Slow Cooling 
Sn63/Pb37 SN100C Sn99.3/Cu0.7 Sn/Ag3.8/Cu0.1 Sn/Ag3/Cu0.5 (SAC305)
Vibration Testing
Testing by JCAA/JG-PP has determined that SN100C is superior to SAC alloy and tinlead for vibration testing when combined
with a NiPdAu or tin part finish. Additional information on this testing may be found in “JCAA/JG-PP No-Lead Solder
Project: Vibration Test” by Thomas A. Woodrow of Boeing Phantom Works.
Alloy Compatibility
Testing has demonstrated that no degradation occurs when mixing SN100C with tinsilver- copper or other lead-free alloys.
Therefore, it is acceptable to utilize SN100C for wave soldering and SAC305 for SMT without compromising reliability.
Furthermore, no reliability degradation is found when using SN100C wire to touch up SAC305 solder joints and vice
versa. Please contact AIM or visit www.leadfree.com for a full report on this issue.
Availability
* Bar Solder * Solder Bath Top-Off Alloy (SN100Ce)
* Wire Solder * Other forms such as Solder Paste, Spheres, and Preforms.
详细描述
